Implantation and Wet Chemistry semiconductor processing are two important techniques used in the manufacture of semiconductor devices.
Implantation is a process in which dopant ions are implanted into a semiconductor material, such as silicon, to modify its electrical properties. This is achieved by bombarding the material with high-energy ions, which knock out some of the existing atoms and replace them with dopant atoms. The dopant ions can be implanted in a specific pattern to create p-n junctions, which are essential components in devices such as diodes and transistors.
Wet chemistry semiconductor processing, on the other hand, involves the use of chemical solutions to modify the surface properties of a semiconductor material. This can be used to etch away certain parts of the material, create a thin oxide layer, or deposit a layer of metal on the surface. Wet chemistry techniques can also be used to clean and prepare the surface of the material prior to other processing steps.
Both implantation and wet chemistry processing are important steps in the fabrication of semiconductor devices. Implantation is used to create the doped regions that are necessary for the operation of electronic devices, while wet chemistry processing is used for a variety of purposes, such as surface cleaning and preparation, etching, and deposition.